International Journal For Multidisciplinary Research

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Addressing Power and Thermal Challenges in Advanced Packaging for AI CPUs/GPUs: Insights into Multi-die Stacking Technology

Author(s) Monish Katari, Jawaharbabu Jeyaraman, Ikram Ahamed Mohamed, Kumaran Thirunavukkarasu
Country United States
Abstract The rapid advancement of artificial intelligence (AI) has propelled the demand for high-performance computing systems, leading to significant challenges in power and thermal management in advanced packaging for AI CPUs/GPUs. This research paper explores various strategies and technologies to address these challenges. It examines the principles and types of multi-die stacking technology, power optimization techniques, and advanced thermal management solutions. Furthermore, the paper discusses the integration of power and thermal management strategies and their synergistic effects. Case studies and numerical analyses highlight the effectiveness of these approaches in improving energy efficiency, performance, and reliability in AI semiconductor devices. The paper also identifies emerging technologies, such as heterogeneous integration and chiplet-based architectures, and outlines future directions for innovation in advanced packaging. Overall, by leveraging comprehensive research and collaboration, the semiconductor industry can drive the development of advanced packaging solutions that meet the growing demands of AI workloads and enable transformative advancements across industries and applications.
Keywords Artificial intelligence, Advanced packaging, Multi-die stacking, Power management, Thermal management, Heterogeneous integration, Chiplet-based architectures.
Field Engineering
Published In Volume 5, Issue 6, November-December 2023
Published On 2023-11-07
Cite This Addressing Power and Thermal Challenges in Advanced Packaging for AI CPUs/GPUs: Insights into Multi-die Stacking Technology - Monish Katari, Jawaharbabu Jeyaraman, Ikram Ahamed Mohamed, Kumaran Thirunavukkarasu - IJFMR Volume 5, Issue 6, November-December 2023. DOI 10.36948/ijfmr.2023.v05i06.17017
DOI https://doi.org/10.36948/ijfmr.2023.v05i06.17017
Short DOI https://doi.org/gtq3bx
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